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Event: OnScale at EDI CON USA 2018, Silicon Valley

By Team OnScale 26 September 2018

OnScale has been invited to the Electronic Design Innovation Conference & Exhibition, at the Santa Clara Convention Center in California to demonstrate how the world of electronic design continues to scale up.

EDI CON brings together experts from around the UA and the world on Radio Frequencies, 5G, Internet og Things, Autonomous vehicles, sensors and more to demonstrate their latest findings, problem solve and network.

Our VP of Engineering, Gerry Harvey, will be in attendance to demonstrate how the power of world-class solvers and Cloud HPC can accelerate engineering effort and reduce costs using OnScale.

Check out what’s on:
EDI CON Agenda
Visit www.ediconusa.com to get a conference pass and if you use code “FOB_EDI18”, you get a FREE conference pass!

You can regiter for EDI CON USA 2018 here:
EDI CON USA 2018

Team OnScale
Team OnScale

OnScale was founded in 2018 by a team of scientists and engineers dedicated to delivering world-class CAE on next-gen Cloud HPC.