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Event: Presenting with IEEE in Silicon Valley

By Team OnScale 12 September 2018

On the 26th of September, OnScale will be demonstrating how using our Cloud Based CAE solution can save precious time and funding for the MEMS industry, at the Texas Instruments Campus in Santa Clara.

With the tech industry having shorter and shorter product life-cycles, falling short of customer specifications and expectations as well as losing precious funding and R&D time to prototyping can be devastating to any company working with MEMS.

On the Texas Instruments, Inc Santa Clara Campus, the birthplace of the Speak & Spell, OnScale will be demonstrating how we help companies like Qualcomm and Siemens drive down cost and risk for new MEMS devices, with the presentation “Learn how to leverage Cloud CAE to minimize cost, risk and time-to-market for new MEMS technologies.”

This will be open to the public and presented by our CEO, Ian Campbell on the 26th of September with doors open at 6:30pm for networking and pizza, you can find the presentation at 2900 Semiconductor Drive, Building E Conference Center.

You can find out more about the presentation here:
Learn how to leverage Cloud CAE to minimize cost, risk, and time-to-market for new MEMS technologies

Find out more about our CEO, Ian Campbell here:
Ian Campbell LinkedIn

Team OnScale
Team OnScale

OnScale was founded in 2018 by a team of scientists and engineers dedicated to delivering world-class CAE on next-gen Cloud HPC.