Hollow Sphere

This simulation tutorial will walk you through the following:

• Applying thermal power and temperature boundary conditions
• Viewing the temperature distribution in the simulation results

Import the CAD file

1. In OnScale Solve, from the Projects tab of the dashboard, create a new project.
2. In the ToolBar, click (+) and then Library. Within the OnScale Library, Select Hollow Sphere.

Assign a material

1. Using the Model tree, select the Top Covering and Bottom Covering.
2. From the Material dropdown in the properties panel, assign Aluminum as the material to the two selected parts.
3. Using the Model tree, select the Hollow Sphere Section, and assign copper.

Add a power source

1. Select the tab.
2. In the toolbar, ensure that the Mechanical Physics is toggled off, and enable Thermal Physics.
3. Select the Thermal icon , then select Power load.
4. Select the Hollow Sphere Section part from the Model tree.
5. Change the Load type from Total Power to Power Density from the Type dropdown menu.
6. Enter 100 W/m3 in the Power property panel, then select Done.

Fix the temperature

1. Select the Thermal icon , then select the Temperature constraint.
2. Using the Model tree, Select the outer coverings: 
   • Bottom Covering > Bottom Face 
   • Top Covering >  Top Face
3. Enter 25 deg. C in the Temperature property panel, then select Done.

Run a simulation

1. Select the simulator tab.
2. Click on the Launcher to run the simulation.
3. Once the meshing and estimation is complete, Select Launch to run the simulation study.

Analyze the results

1. Once the simulation has finished, select Load Results to open the results in the Results tab.
2. Temperature will be the selected dataset for a Thermal simulation.
3. Expand the Settings option and toggle Show Mesh on.
4. The maximum operational temperature on the PCB is 20 degrees Celsius.