This simulation tutorial will walk you through the following:
- Applying thermal power and temperature boundary conditions
- Viewing the temperature distribution in the simulation results
Import the CAD file
- In OnScale Solve, from the Projects tab of the dashboard, create a new project.
- In the ToolBar, click (+) and then Library. Within the OnScale Library, Select Hollow Sphere.
Assign a material
- Using the Model tree, select the Top Covering and Bottom Covering.
- From the Material dropdown in the properties panel, assign Aluminum as the material to the two selected parts.
- Using the Model tree, select the Hollow Sphere Section, and assign copper.
Add a power source
- Select the tab.
- In the toolbar, ensure that the Mechanical Physics is toggled off, and enable Thermal Physics.
- Select the Thermal icon , then select Power load.
- Select the Hollow Sphere Section part from the Model tree.
- Change the Load type from Total Power to Power Density from the Type dropdown menu.
- Enter 100 W/m3 in the Power property panel, then select Done.
Fix the temperature
- Select the Thermal icon , then select the Temperature constraint.
- Using the Model tree, Select the outer coverings:
- Bottom Covering > Bottom Face
- Top Covering > Top Face
- Enter 25 deg. C in the Temperature property panel, then select Done.
Run a simulation
- Select the simulator tab.
- Click on the Launcher to run the simulation.
- Once the meshing and estimation is complete, Select Launch to run the simulation study.
Analyze the results
- Once the simulation has finished, select Load Results to open the results in the Results tab.
- Temperature will be the selected dataset for a Thermal simulation.
- Expand the Settings option and toggle Show Mesh on.
- The maximum operational temperature on the PCB is 20 degrees Celsius.