Printed circuit board (PCB)
This simulation tutorial will guide you through:
- Importing a multipart assembly
- Applying thermal power and convection boundary conditions
- Viewing the temperature distribution in the simulation results.
- Changing the viewing options from the Palette.
- Determining if the PCB is susceptible to melting or burning.
Import the CAD file
- In OnScale Solve, from the Projects tab of the dashboard, create a new project.
- In the ToolBar, click (+) and then Library. Within the OnScale Library, Select PCB.
Assign the materials
- Using the Model tree, select the following Parts of the PCB: Chip a, Chip b, Chip c, Chip d, and Main Chip.
- From the Material dropdown in the properties panel, assign Silicon to all five selected parts.
- Select the Heatsink of the PCB, and assign Aluminum to this part in the Material dropdown of the properties panel
- Select TIM and assign Thermal Grease to this part.
- Select the PCB and assign Glass to it.
Add the power sources
- Select the
tab.
- In the toolbar, ensure that the Mechanical Physics tab is toggled off, and enable Thermal Physics.
- Select the Thermal icon
, then select Power load.
- Select the following parts: Chip a, Chip b, and Chip c and apply a power load of 0.2 W in the properties panel, then click Done.
- Select the Thermal icon
, then select Power load.
- Select Chip d, apply a load of 0.05 W, and click Done.
- Select the Thermal icon
, then select Power load.
- Select the Main Chip, apply a load of 20 W , and click Done.
Add the convection coefficient
- Select the Thermal icon
, then select Convection constraint.
- Using the Model tree, click on the dropdown arrow within the Heatsink of the PCB.
- Hold down the Shift key, and select faces from Face 1 to Face 42 of the Heatsink.
- Enter 15 W/m^2 deg. C under the Convection Coefficient field of the properties panel. Then, select Done.
Run a simulation
- Select the simulator tab.
- Click on the Launcher to run the simulation
- Once the meshing and estimation is complete, Select Launch to run the simulation study.
Analyze the results
- Once the simulation has finished, select Load Results to open the results in the Results tab.
- Temperature will be the selected dataset for a Thermal simulation.
- Expand the Legend in the Properties Panel
- Select Plasma Inverted in the Palette select drop down.
- Expand the Settings option and toggle Show Mesh on.
- The maximum operational temperature on the PCB is 72.9 degrees Celsius.
- The melting temperature of glass is 1400 degrees Celsius. Therefore, the board should not experience melting at the operational Power.