High-Density Packaging Design with OnScale Cloud Engineering Simulation

In this webinar, we describe OnScale’s revolutionary approach that combines state-of-the-art proprietary multiphysics solvers and cutting-edge high-performance computers on the cloud. We also describe OnScale’s unique technology and business approach, which gives users the ability to run the thousands of simulations required to fully optimize the electronics package using a flip-chip, all in a fraction of the usual time and cost.